Our products enable a new affordable market entry point for Ka-band antenna applications
Employment of state-of-art CMOS and GaAs process results in a highly integrated, low cost RFIC design like no other.
Low profile, high performance, and system in package (SiP) BGA modules consist of embedded antennas and flip-chip to attach silicon dies to low temperature co-fired cermain (LTCC), PCB, and other high frequency substrates.
Based in Pasadena, California, Tubis Technologies' privately and internally funded company was established to target high growth areas related to the cmWave and mmWave phased array, beam forming products, and systems. On site are our design and test laboratories for Ka band active phase-array antennas run by our experienced design team.
It's more than a job, its an exploration into uncharted territory. Put yourself at the front edge of groundbreaking, powerful technology.
150 South Los Robles Avenue, Suite 830
Pasadena, CA 91101, USA